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Intel Brings Latest Design and Engineering Centre in Hyderabad

Over the last 20 years, Intel India has invested significantly in R&D in the country and has been consistently leading in developing the tech ecosystem

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Intel
The Intel design centre will contribute to computing and communications technology innovations geared towards addressing critical challenges in today's data-centric world and advance the firm's engagements with the city's technology ecosystem by fostering entrepreneurship and a research mindset. Wikimedia Commons

Expanding its innovation footprint in India, global chip making giant Intel on Monday unveiled its new design and engineering centre here which was inaugurated by Telangana’s Information Technology Minister K. T. Rama Rao.

Spread across 300,000 square feet, the centre can accommodate 1,500 people. The state-of-the-art facility comprises six LEED Platinum certified floors, modern amenities and an incubation centre for hardware and systems start ups in the IT corridor of the city.

LEED or Leadership in Energy & Environmental Design Platinum certification is the highest rating for green buildings, recognised worldwide.

“Over the past 50 years, Intel has brought immense compute power to millions of people, transforming the way we live and work. We are now ushering in a new era of ‘Exascale Computing’ driven by the rise of artificial intelligence,” Raja M Koduri, Senior VP, Chief Architect and GM of Architecture, Graphics & Software, Intel Corporation, said in a statement.

The design and engineering centre was opened in the presence of Raja M Koduri, Senior VP, Chief Architect and GM of Architecture, Graphics and Software at Intel Corporation and Nivruti Rai, Country Head, Intel India and Vice President, Data Centre Group, Intel Corporation.

Intel
Expanding its innovation footprint in India, global chip making giant Intel on Monday unveiled its new design and engineering centre here which was inaugurated by Telangana’s Information Technology Minister K. T. Rama Rao. Wikimedia Commons

“Exascale for everyone is an exciting vision and it requires fundamental disruptions across the technology stack. Intel’s design and engineering centres will play a critical role in driving this mission and I look forward to the new centre in Hyderabad delivering breakthrough technologies to propel the company’s growth,” Koduri added.

The design centre will contribute to computing and communications technology innovations geared towards addressing critical challenges in today’s data-centric world and advance the firm’s engagements with the city’s technology ecosystem by fostering entrepreneurship and a research mindset.

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“Over the last 20 years, Intel India has invested significantly in R&D in the country and has been consistently leading in developing the tech ecosystem. We have made significant impact in areas such as Cloud, client, graphics, AI, 5G, and autonomous systems and our new design facility in Hyderabad will enable us to further boost innovation for India and the world,” said Nivruti Rai, Country Head of Intel India and VP of Data Center Group, Intel Corporation. (IANS)

Next Story

Here Are Some Latest Details About Upcoming Apple iPhone 12

Recently, J.P. Morgan analyst Samik Chatterjee claimed that Apple will release a 5.4-inch iPhone, two 6.1-inch iPhones and one 6.7-inch iPhone with 5G connectivity in 2020

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Apple
Apple is preparing to release a new iPad Pro, a new MacBook and an augmented reality (AR) headset by the first half of 2020. Pixabay

Apple is expected to launch as many as four new iPhones spread across different display sizes in 2020 and now Apple analysts, Macotakara shared more details about the iPhone 12 design from a source from company’s supply chain in Asia.

The report claimed that the iPhone 12 will come in three size versions, including 5.4-inch, 6.1-inch, and 6.7-inch, but Apple will release two distinct 6.1-inch models, according to the source.

The 6.7-inch model will have a thickness around 7.4mm, which would be nearly 10 per cent thinner than the iPhone 11 Pro Max at 8.1mm.

Additionally, it also claims that the 6.7-inch model will be slightly taller than the iPhone 11 Pro Max and feature a triple-lens rear camera.

Recently, J.P. Morgan analyst Samik Chatterjee claimed that Apple will release a 5.4-inch iPhone, two 6.1-inch iPhones and one 6.7-inch iPhone with 5G connectivity in 2020.

Chatterjee predicts the company may introduce two high-end models (one 6.1-inch and one 6.7-inch) with support for mmWave, as well as a triple-lens camera and “world facing” 3D sensing for improved Augmented Reality capabilities.

Earlier Kuo also said that Apple is preparing to release a new iPad Pro, a new MacBook and an augmented reality (AR) headset by the first half of 2020.

Apple
Apple is expected to launch as many as four new iPhones spread across different display sizes in 2020 and now Apple analysts, Macotakara shared more details about the iPhone 12 design from a source from company’s supply chain in Asia. Pixabay

Kuo expects Apple to team up with third parties to create the first batch of AR headsets.

The new iPad Pro models will be launched in the first quarter and will reportedly come with a rear-facing 3D Time-of-Flight sensor for increased accuracy in depth-of-field photography.

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While, a MacBook with a new scissor-switch keyboard could be launched in Q2 2020. (IANS)